Processing Workflow and Application Cases for AI Chip Packaging and Testing Wafer Templates

With the rapid development of the artificial intelligence, big data and computing power industries, high-end AI chips are gradually evolving towards higher integration, multi-core architecture, miniaturisation, and high-frequency, high-speed operation. As advanced packaging and wafer-level testing processes continue to advance, the precision, stability and compatibility of supporting precision templates are subject to far stricter requirements than those for conventional chips. AI chip packaging and testing wafer templates are core precision components specifically designed for AI chip wafer packaging, electrical testing, functional calibration and yield screening. Compatible with advanced packaging processes such as WLP, BGA and Chiplet, they enable the precise execution of critical processes including high-density pin alignment, fine-pitch solder paste printing and high-frequency signal testing, serving as the core medium for ensuring the precision and performance stability of AI chip mass production. Customised AI chip packaging and testing wafer stencils can be designed with bespoke structures tailored to the core parameters, packaging architectures and testing conditions of different computing power chips. This addresses industry pain points where standardised stencils cannot accommodate the high-density arrays, ultra-fine pitch and high-frequency testing requirements of AI chips, thereby meeting the R&D and mass production needs of various high-end AI chips. The custom fabrication of AI chip packaging and testing wafer templates relies on integrated precision processes, including precision photolithography, low-stress pulse electroforming, ultra-fine structure forming, and Class 100 cleanroom post-processing. This enables the stable formation of ultra-thin, ultra-fine, and high-density array templates, providing high-precision, highly reliable customised solutions for the AI chip packaging and testing stages.

The custom fabrication of AI chip packaging and testing wafer templates follows a standardised precision workflow tailored to high-end AI chip manufacturing processes. The entire process is completed in a closed-loop system within a cleanroom, encompassing customised design, precision master template preparation, micro-pattern transfer, low-stress forming, non-destructive demoulding and trimming, cleanroom strengthening treatment, comprehensive precision inspection, and anti-static packaging delivery. Each of these eight core processes has its parameter system optimised to meet the high-frequency, high-precision and high-reliability requirements of AI chips. Unlike conventional semiconductor template processing, the customisation of AI chip packaging and testing wafer templates places particular emphasis on enhancing micro-hole verticality, board surface flatness, structural consistency and fatigue resistance, effectively mitigating issues commonly encountered in AI chip packaging and testing such as signal interference, alignment shifts, uneven printing and testing misjudgements. The customised processing of wafer templates for AI chip packaging and testing moves away from a crude mass-production model. Centred on AI chip packaging process standards, it implements meticulous control throughout the entire process—from design and production to inspection—to fully accommodate the differentiated production requirements of high-computing-power AI chips, edge AI chips and smart vision chips.

Requirement alignment and solution customisation are the core preliminary processes for the customisation of wafer templates used in the packaging and testing of AI chips, and are also essential prerequisites for ensuring that the templates are compatible with the specific manufacturing processes of AI chips. Prior to commencing production, a bespoke structural design is developed based on the AI chip’s wafer dimensions, core array layout, micro-pin pitch, high-frequency test points, packaging equipment parameters and operating environment. To address the characteristics of AI chips—including high-density integration, fine-pitch pins and high-frequency signal transmission—we optimise the template thickness, microvia aperture size, via spacing and positioning benchmarks, whilst incorporating stress-relief structures to prevent board deformation and signal deviation during high-frequency testing. Through process simulation and parameter verification, we validate the feasibility and stability of the customised solution, producing standardised production drawings. This provides precise data support for the custom fabrication of AI chip packaging and testing wafer templates, ensuring a high degree of compatibility between the templates and the AI chip packaging and testing processes from the outset.

The preparation of precision master templates and pattern transfer are fundamental steps in ensuring the accuracy of customised wafer template manufacturing for AI chip packaging and testing. Master templates are fabricated using quartz substrates with high flatness, high light transmittance and low deformation to meet the ultra-fine structural forming requirements of AI chips. Utilising laser direct writing and deep ultraviolet lithography processes, we precisely replicate the high-density micro-hole arrays, precision alignment grooves and signal conduction structures required for AI chip packaging and testing. We accurately reproduce the chip pin layout and test points, achieving sub-micron level pattern precision to ensure sharp, burr-free and distortion-free pattern edges. Following master mould formation, comprehensive screening using high-magnification microscopy is conducted to eliminate defective products such as misaligned positions, incomplete patterns, and surface defects. Strict control of exposure, development, and curing parameters ensures the precise replication of microstructures, laying a solid foundation for the accuracy of customised AI chip packaging and testing wafer templates and establishing a robust process benchmark for subsequent precision forming.

Low-stress precision moulding is the core critical process in the custom fabrication of wafer templates for AI chip packaging and testing. To meet the high-precision requirements of AI chip packaging and testing, a low-stress pulse electroforming process is employed. The master mould, having undergone conductive pre-treatment, serves as the cathode and is placed in a temperature-controlled, sealed electroforming tank alongside a high-purity metal anode. Precise control of the electrolyte composition, temperature, pulse current density and deposition rate ensures that metal ions are deposited uniformly, densely and at a slow rate, effectively releasing internal metal stresses and completely resolving warping and deformation issues in ultra-thin templates. The resulting templates feature vertically aligned micro-pores with uniform aperture sizes and consistent array heights, perfectly suited to the high-density pin packaging and high-frequency signal testing requirements of AI chips. This eliminates packaging defects and testing errors caused by structural deviations, fully demonstrating the technical advantages and adaptability of custom-manufactured wafer templates for AI chip packaging and testing.

Non-destructive demoulding and ultra-clean post-processing are critical processes for optimising the performance of customised AI chip packaging and testing wafer templates. Upon completion of the forming process, a gentle, non-destructive demoulding technique is employed to achieve complete separation of the template from the master mould, thereby preventing micro-hole collapse, board deformation, and structural damage caused by external pulling forces. Following demoulding, the templates undergo multi-stage ultrasonic cleaning with purified water, plasma purification and vacuum drying to thoroughly remove residual electrolyte, metal debris and microscopic dust impurities from within the micro-pores and on the board surface, thereby meeting the high cleanliness standards required for AI chip packaging and testing. Additionally, depending on custom requirements, processes such as electrolytic polishing, passivation for corrosion protection, and stress relief treatment are carried out. These enhance the surface finish, electrical conductivity stability and fatigue resistance of the template, reduce signal loss during high-frequency testing, extend the template’s service life, and further improve the quality and operational reliability of custom-manufactured wafer templates for AI chip packaging and testing.

Comprehensive precision inspection and clean packaging are the final steps in ensuring the quality of custom-manufactured wafer templates for AI chip packaging and testing. Equipped with precision instruments such as coordinate measuring machines, laser aperture testers, flatness testers, and high-frequency continuity testers, we conduct comprehensive inspections of core metrics including template thickness, micro-hole precision, array spacing, surface flatness, cleanliness, and high-frequency continuity stability. We also perform specialized parameter verification for structures custom-designed for AI chips, ensuring that all specifications fully comply with high-end AI packaging and testing standards. Templates that pass inspection undergo anti-static vacuum packaging in a Class 100 cleanroom environment, effectively isolating them from dust, moisture, and oxidative corrosion. This prevents precision drift and structural contamination during transportation and storage, ensuring the templates can be immediately deployed for stable mass production upon installation—fully demonstrating the premium quality of custom-made AI chip packaging and testing wafer templates.

Custom-manufactured AI chip packaging and testing wafer templates are compatible with all categories of AI chip packaging and testing scenarios, covering mainstream products such as high-performance cloud computing chips, edge AI chips, smart vision chips, and automotive AI chips. They are widely used in high-end fields such as AI servers, smart terminals, autonomous driving, and industrial smart devices, providing critical supporting infrastructure for the AI chip industry’s scalable and high-end development.

In the case of cloud-based high-performance AI chip packaging and testing, these chips feature a large number of cores, high array density, and fast signal transmission rates, placing extremely high demands on template precision and consistency. Through the customization of AI chip packaging and testing wafer templates, the layout of high-density micro-hole arrays is optimized, and hole position tolerances and board flatness are strictly controlled, effectively resolving the challenges of difficult alignment and high testing errors associated with dense pin packaging. Custom manufacturing of wafer templates for AI chip packaging and testing supports the integrated molding of ultra-large arrays, ensuring consistency in batch packaging and testing, and significantly improving the mass production yield of high-performance AI chips.

In automotive AI chip packaging and testing applications, these chips must withstand harsh operating conditions characterized by wide temperature ranges, high vibration, and stringent reliability requirements, placing rigorous demands on the structural strength and stability of the wafer templates. By customizing wafer templates for AI chip packaging and testing, we enhance their corrosion resistance and fatigue-resistant structural design, optimize high-frequency test contact points, and ensure compatibility with automotive-grade long-term continuous testing operations. Custom fabrication of AI chip packaging and testing wafer templates effectively enhances template weather resistance and stability, ensuring the packaging quality and reliability of automotive AI chips upon shipment.

In edge AI chip packaging and testing applications, small edge AI chips feature extremely compact dimensions and narrow pin pitches, making standard templates incapable of meeting precision packaging requirements. Through customized AI chip packaging and testing wafer templates, we create ultra-fine-pitch, ultra-thin precision templates tailored for the fine-scale packaging and electrical testing of microchips. Custom fabrication of AI chip packaging and testing wafer templates precisely controls microstructural accuracy, effectively reducing packaging defects and testing misreadings, thereby supporting the iterative development of lightweight and miniaturized end-user AI chips.

Overall, precision custom templates are indispensable core components in the high-end AI chip packaging and testing industry, directly impacting the performance accuracy and mass production capabilities of AI chips. Custom AI chip packaging and testing wafer templates continuously align with the iterative trends in AI chip technology, constantly optimizing structural designs and process solutions. Relying on mature low-stress precision molding and cleanroom process technologies, the custom manufacturing of these templates continuously breaks through precision bottlenecks, providing reliable customized solutions for the packaging and testing of various high-end AI chips, and supporting the high-quality upgrading and development of the artificial intelligence semiconductor industry.